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Ultrasonic gold wire ball welding machine is a process method that uses ultrasonic welding wire technology to achieve bonding on solid welded parts through ultrasonic vibration under the combined action of pressure and ultrasonic energy. The ultrasonic transducer vibration system generates longitudinal displacement vibration, and the amplitude of the vibration is amplified and transmitted to the welding cutter, causing friction between the two metal contact surfaces. In the initial stage of welding, the oxide film and impurities in the welding area are eliminated, and vibration friction allows for full contact between the two metals; In the primary stage of welding, friction makes the welding zone warm up, and the interface produces plastic deformation. At the same time, under the action of a certain pressure, two kinds of Metallic bonding are bonded together to form a solid mechanical connection, that is, to realize the welding of small gold wires to connect the IC chip electrode and the bonding pad on the frame, so as to realize the high-tech electromechanical integration equipment for the internal lead welding of the chip (silicon chip) before packaging. Its main function is to connect the internal circuits of the chip with gold wire or connect the internal circuits with pins before packaging p> The gold wire welding machine is mainly used for inner lead welding of light-emitting diodes, laser tubes, small and medium-sized power transistors, integrated circuits, and some special semiconductor devices p>
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