Leave a message
Please submit your request and we will contact you as soon as possible
-
Name*
-
Phone*
-
Product Center
Xuchen Key Alloy Wire
English name: Gold bonding wire, also known as ball bonding wire or lead wire. Meaning: Gold wire used as a connecting wire in integrated circuits. Purity: Gold content 299, 99%. Bond alloy wire is an important material in the microelectronics industry, used as a connecting wire between chips and lead frames Building alloy lines is an important step in the production of integrated circuits, which involves connecting circuit chips with lead frames. Bonding wire is a micro metal wire inner lead used during the assembly of semiconductor devices and integrated circuits to achieve electrical connection between the input/output bonding points of the circuit inside the chip and the internal contacts of the lead frame. The bonding effect directly affects the performance of integrated circuits. Bonding wire is one of the five basic materials in the overall 1C packaging material market. It is an inner lead material with excellent electrical, thermal, mechanical, and chemical stability. It is an important structural material for manufacturing integrated circuits and discrete devices. Bonding wire is mainly used in various electronic components, such as diodes, transistors, integrated circuits, etc.